Huawei's Ascend roadmap delays 3D LogicFolding until 2030, leaving upcoming 910C and 950 chips reliant on 2.5D packaging

From: Huawei's Ascend roadmap delays 3D LogicFolding until 2030, leaving upcoming 910C and 950 chips reliant on 2.5D packaging

Teortaxes▶️ (DeepSeek 推特🐋铁粉 2023 – ∞)@teortaxesTex·4hQuote tweet

What's the largest WSE-3-based cluster? I see there were plans for max 2048 "systems" (ie wafers). That's 47 MW, plus change. Huawei 950 SuperCluster is likely >500 MW, 960 (2027) >1 GW? And they want >30 KW *chips* by 2030. Imagine. 32K wafers, working as one.

Zephyr@zephyr_z9·5hView on

WSE-2 consumes 20kW while WSE-3 consumes 23kW

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