Huawei's Ascend roadmap delays 3D LogicFolding until 2030, leaving upcoming 910C and 950 chips reliant on 2.5D packaging

From: Huawei's Ascend roadmap delays 3D LogicFolding until 2030, leaving upcoming 910C and 950 chips reliant on 2.5D packaging

Teortaxes▶️ (DeepSeek 推特🐋铁粉 2023 – ∞)@teortaxesTex·8hOriginal post

the crazy part in Tingbo He's paper that I missed is that Ascend isn't going to use LogicFolding until 2030s. They don't have the tools to design their NPUs in 3D. Frankly this looks very bad for them, so bad I think it'll be revised.

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Huawei's Ascend roadmap delays 3D LogicFolding until 2030, leaving upcoming 910C and 950 chips reliant on 2.5D packaging · Digg