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HBM4E Wafer at Computex Reveals 140mm² Die Size, Tightening Supply

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Zephyr#1497
Original postZephyr#1497
finánce@racetrack275

This is a HBM4E wafer from Computex (photo koreajoongangdaily)

Die is 1c 32Gb, minimum 140mm2 size. Likely 145-150, since HBM4 JEDEC package size is 155.6mm2. HBM eats fab cap as die size goes up every gen. There is no memory supply coming pre-2030 that offsets this.

7:30 AM · Jun 2, 2026 · 14K Views
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