Analyst Zephyr says Lenovo's diamond-copper heat spreader is driving adoption of synthetic diamonds to cool advanced AI semiconductors
The components manage high heat from DUV lithography chips.
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Teortaxes▶️ (DeepSeek 推特🐋铁粉 2023 – ∞)@teortaxesTex
An amusing way to cope with higher heat dissipation requirement of DUV chips: DIAMOND HEAT SINKS. Out of such pieces, a whole different ecosystem may be formed.
Zephyr@zephyr_z9
Lenovo releasing a diamond-copper composite heat spreader was the catalyst
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