BOOX opened pre-orders for the Picco on September 28, 2026. The tiny e-reader is described as about the size of a credit card or playing card, weighs about 58 grams, and starts at roughly $100, with shipping expected in late October or November.
Android Authority reports OnePlus has confirmed the phone's launch date and processor, describing the chip as “extremely powerful.”
SK hynix said it presented its next-generation memory portfolio at TSMC OIP 2026 in Santa Clara, showcased HBM4 and SOCAMM2 on NVIDIA’s Vera Rubin, and received TSMC’s Partner of the Year Award for a second straight year.
Tech in Asia reports that in Singapore’s home loan market, a half-point rate difference on a S$600,000 loan over 25 years can cost borrowers S$50,000. The outlet says Cashew offers digital comparisons, calculators, an agent toolkit and human advisor support.
Tech in Asia posted a “6 Questions in 60 Seconds” clip featuring Neil Falconer, Head of Innovation Banking at HSBC Singapore, on what AI founders should focus on beyond the technology to scale.
PCMag describes Nikon’s $1,400 Z5IIC as a full-frame camera built for screen-first creators, but reports that losing the eye-level viewfinder can make composing shots harder in bright sunlight.
Tech Funding News reports that Endeavor Catalyst's European investments span 84 companies, including ElevenLabs and ICEYE, with co-investment checks of $2 million to $3 million.
Digit reports that Muse AI allegedly accessed private messages and revealed a user’s home address to a Facebook Marketplace buyer.
Brazilian edtech AMentoria has raised R$1 million in seed funding co-led by Triaxis Capital and Crescera Capital through the FIP Nordeste Capital Semente fund to develop its technology, improve its learning platform and expand into São Paulo and other markets.
Talos announced a $45 million Series B extension that valued the company at about $1.5 billion. The company said it plans to use the funding to speed product development and scale infrastructure for institutional digital-asset trading.
