Huawei's not that bad 1152 GB HiZQ 2.0, *can be stacked* this isn't DGX Station
Unreleased 8x Ascend 950 SuperPoD (codenamed 850E)
The system's per-chip specs slightly beat Nvidia's H200 GPU.
Huawei's not that bad 1152 GB HiZQ 2.0, *can be stacked* this isn't DGX Station
Unreleased 8x Ascend 950 SuperPoD (codenamed 850E)
Some users see the Huawei Atlas 850E SuperPoD as useful for MoE inference and small experiments due to its memory capacity, while others dismiss interest in the hardware with insults.
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looks nice Specs are solid Total memory bandwidth is 4TB/s per chip A bit stronger than H100s
Unreleased 8x Ascend 950 SuperPoD (codenamed 850E)
looks nice Specs are solid Total memory bandwidth is 4TB/s per chip A bit stronger than H200s
Unreleased 8x Ascend 950 SuperPoD (codenamed 850E)
will be funny if they offer many such boxes
中昊芯英 unveils next gen TPU AI chip as part of 泰则 2.0 compute cluster that will have 896 TFLOPS compute per chip (1792 TOPS INT8). Each chip uses just 600W of power.
In a 8 TPU + 2 CPU setup, box will have 7.168 PFLOPS of compute. Natively supports PyTorch, vLLM, SGLang & other tools.
Completed integration w/ Qwen, DeepSeek, GLM & Minimax.
Company uses Chiplet + 2.5D packaging & connected in a cluster via optical modules & w/ OCS.
Founder/CEO 杨龚轶凡 was a core member of Google TPU design team for v2/3/4.
This does feel like the Chinese Google TPU.
@zephyr_z9 It's weaker than H200s but has slightly more total memory I think this is pretty good for MoE inference and small experiments
looks nice Specs are solid Total memory bandwidth is 4TB/s per chip A bit stronger than H100s

@zephyr_z9 Do you think memory stocks have topped for the year?

@teortaxesTex You should counsel @yacineMTB on shopping-therapy issues, @teortaxesTex. Just which computer parts with lengthy names I can't be arsed to look up are the ones which define your innermost hopes and dreams?