Independent researcher Lennart Heim says building 15GW of projected AI data centers requires 25 EUV lithography machines operating full-time
The analysis equates this capacity to 750,000 logic wafers.
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The analysis equates this capacity to 750,000 logic wafers.
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Teortaxes▶️ (DeepSeek 推特🐋铁粉 2023 – ∞)@teortaxesTexTECH
That's a pretty good way to look at the situation, because a 300mm wafer is a 300mm wafer and every chip no matter the process is pushed close to its thermal limit. B300 has 814mm^2 x 2 die area and 1400W TDP, H100 is half that, 950 is 2 ≈420mm dies and dissipates like H100. https://twitter.com/ohlennart/status/2074177786269614360
Lennart Heim@ohlennart