[Exclusive] Hanwha Semitech Supplies hybrid bonding cluster to SK Hynix

Hanwha Semitech has supplied SK Hynix with an integrated die-to-wafer (D2W) hybrid bonding system (cluster) that combines multiple process steps into one. The system is undergoing quality evaluation as the company works to improve its completeness. In addition, Hanwha Semitech is understood to have supplied SK Hynix with additional thermo-compression (TC) bonders for HBM4 production.

According to industry sources on the 10th, Hanwha Semitech's second-generation D2W hybrid bonder, the 'SHB2 Nano' model, was moved into a line at an SK Hynix fab in April. It was delivered not as a standalone hybrid bonder but in cluster form. It is currently undergoing quality evaluation by SK Hynix, with improvement work in progress.

A hybrid bonding cluster refers to the integration of all equipment required for the hybrid bonding process into a single system. A representative example is 'Kinex,' jointly developed by Applied Materials and BE Semiconductor Industries (Besi). It combines Applied Materials' plasma pre-treatment (activation), deionized (DI) water cleaning, and metrology systems with Besi's hybrid bonder.

Hanwha Semitech's hybrid bonding cluster has a structure similar to Kinex. At the front end of the cluster is an equipment front-end module (EFEM) from Cymechs. The EFEM takes wafers out of the front opening unified pod (FOUP) and delivers them to the process equipment.

Next comes Hanwha Semitech's in-house plasma activation module. Plasma activation is a process in which plasma is irradiated onto the wafer surface to change its chemical and physical properties, rendering it hydrophilic so that hydroxyl groups (OH) can readily attach.

A cleaning module from Zeus is also incorporated. Wet-cleaning the activated wafer with DI water removes foreign matter (particles). As water molecules bond with the wafer surface, OH groups are formed. The OH groups ensure that when the die and wafer come into contact, the dielectric bonds before the copper does.

The final component of the cluster is Hanwha Semitech's SHB2 Nano, which performs the hybrid bonding process of aligning and bonding the die to the wafer.

Hanwha Semitech had originally been in talks with PSK Holdings to secure plasma activation equipment through the end of last year. PSK Holdings is the parent company of PSK, which possesses plasma-based dry cleaning equipment. However, the collaboration appears to have fallen through as Hanwha Semitech developed its own plasma activation module.

According to industry sources, there are three reasons hybrid bonder makers supply equipment to customers in cluster form. Hybrid bonding involves nanometer-scale precision bonding, so even fine dust can easily cause defects. As a result, an ISO Class 3 environment must be maintained. ISO Class 3 denotes a high level of cleanliness that limits particles 0.5 micrometers (㎛) or larger in diameter to no more than 1,000 per cubic meter (㎥).

Clusters also enable faster processing compared with running the process on individual standalone tools, thanks to reduced wait times. Completing all process steps on individual tools takes 10 hours, whereas the Applied-Besi Kinex takes one hour. The footprint occupied in limited cleanroom space is also reduced. The result is higher productivity.

Another industry official emphasized, "Since building cleanrooms requires enormous cost and time, semiconductor manufacturers have recently been pursuing maximum space efficiency. Ultimately, the competitiveness of a hybrid bonder comes down to how much it can reduce its footprint."

Samsung Electronics and SK Hynix have already adopted the Applied-Besi Kinex on some mass-production lines. The Kinex is known to be priced at around KRW 15–20 billion.

Hanwha Semitech is also reported to have recently won an additional order from SK Hynix for TC bonders used in HBM4 production. One semiconductor industry official said, "Hanmi Semiconductor and Hanwha Semitech recently each won HBM4 TC bonder orders from SK Hynix of similar size. It wasn't disclosed because it isn't subject to mandatory disclosure requirements."

Hanmi Semiconductor disclosed on the 8th that it would supply SK Hynix with HBM4 TC bonders worth KRW 44.2 billion.

SK Hynix responded, "We are unable to confirm matters related to our suppliers."