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TSMC and Samsung commit to ASML’s newest chipmaking tools, CNBC reports

AI is driving demand for smaller, more complex semiconductors, CNBC says.

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7 Sources, 24d ago, first seen 24d ago

TLDR

CNBC reports that TSMC and Samsung will adopt ASML’s High NA EUV tools for advanced chipmaking, as AI drives demand for smaller, more complex semiconductors.

Combined views

73.3K

7 Sources, first seen 24d ago

125 likes8 comments23 saves21 reposts

Combined views

73.3K

7 Sources, first seen 24d ago

125 likes8 comments23 saves21 reposts

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7 Sources

@CNBCTSMC, Samsung commit to ASML’s newest chipmaking tools as AI drives demand https://www.cnbc.com/2026/09/08/tsmc-samsung-asml-high-na-euv-machine-ai-chips.html?taid=6a9fca97298afe0001c62978&utm_campaign=trueanthem&utm_content=main&utm_medium=social&utm_source=twitter24d
@NikkeiAsiaTSMC, Intel and Samsung all bet on ASML's latest chip tool in AI race https://s.nikkei.com/4Aggrh824d
@engadgetASML, TSMC and Samsung are adopting larger chip photomasks that will boost manufacturing yields and lower costs. https://www.engadget.com/2252462/samsung-tsmc-commit-asml-fab/?utm_term=Autofeed&utm_campaign=Echobox-Engadget&utm_medium=Social-Distribution&utm_source=Twitter#Echobox=178886526223d
@qzTSMC and Samsung are committing to ASML's most advanced chip-making machines for AI: Both companies also joined an industry initiative to transition to larger 12-inch photomasks, which are expected to cut chipmaking costs by 2033 https://dlvr.it/TVNQg123d
@HotHardwareThe semiconductor industry is entering a new phase as Samsung and TSMC commit to integrating ASML’s next-generation High Numerical Aperture Extreme Ultraviolet (High NA EUV) lithography into their manufacturing toolkits. https://hothardware.com/news/asml-tsmc-and-samsung-team-up-to-solve-next-gen-chip-bottleneck23d
@arstechnicaTop chipmakers embrace ASML’s $400M machines, agree to crucial chipmaking change https://arstechnica.com/gadgets/2026/09/top-chipmakers-embrace-asmls-400m-machines-agree-to-crucial-chipmaking-change/?utm_campaign=dhtwitter&utm_content=%3Cmedia_url%3E&utm_medium=social&utm_source=twitter23d
@tomshardwareTSMC, Samsung, and Intel shore up support with ASML to deploy larger High-NA EUV photomasks — 6×12-inch photomask transition may take years despite unified effort https://www.tomshardware.com/tech-industry/semiconductors/tsmc-samsung-and-intel-shore-up-support-with-asml-to-deploy-larger-high-na-euv-photomasks-6-12-inch-photomask-transition-may-take-years-despite-unified-effort21d
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    7 Sources

    @CNBCTSMC, Samsung commit to ASML’s newest chipmaking tools as AI drives demand https://www.cnbc.com/2026/09/08/tsmc-samsung-asml-high-na-euv-machine-ai-chips.html?taid=6a9fca97298afe0001c62978&utm_campaign=trueanthem&utm_content=main&utm_medium=social&utm_source=twitter24d
    @NikkeiAsiaTSMC, Intel and Samsung all bet on ASML's latest chip tool in AI race https://s.nikkei.com/4Aggrh824d
    @engadgetASML, TSMC and Samsung are adopting larger chip photomasks that will boost manufacturing yields and lower costs. https://www.engadget.com/2252462/samsung-tsmc-commit-asml-fab/?utm_term=Autofeed&utm_campaign=Echobox-Engadget&utm_medium=Social-Distribution&utm_source=Twitter#Echobox=178886526223d
    @qzTSMC and Samsung are committing to ASML's most advanced chip-making machines for AI: Both companies also joined an industry initiative to transition to larger 12-inch photomasks, which are expected to cut chipmaking costs by 2033 https://dlvr.it/TVNQg123d
    @HotHardwareThe semiconductor industry is entering a new phase as Samsung and TSMC commit to integrating ASML’s next-generation High Numerical Aperture Extreme Ultraviolet (High NA EUV) lithography into their manufacturing toolkits. https://hothardware.com/news/asml-tsmc-and-samsung-team-up-to-solve-next-gen-chip-bottleneck23d
    @arstechnicaTop chipmakers embrace ASML’s $400M machines, agree to crucial chipmaking change https://arstechnica.com/gadgets/2026/09/top-chipmakers-embrace-asmls-400m-machines-agree-to-crucial-chipmaking-change/?utm_campaign=dhtwitter&utm_content=%3Cmedia_url%3E&utm_medium=social&utm_source=twitter23d
    @tomshardwareTSMC, Samsung, and Intel shore up support with ASML to deploy larger High-NA EUV photomasks — 6×12-inch photomask transition may take years despite unified effort https://www.tomshardware.com/tech-industry/semiconductors/tsmc-samsung-and-intel-shore-up-support-with-asml-to-deploy-larger-high-na-euv-photomasks-6-12-inch-photomask-transition-may-take-years-despite-unified-effort21d
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