Intel appoints former SK Hynix CEO Seok-Hee Lee to lead advanced packaging and back-end manufacturing

Seok-Hee Lee joins Intel as EVP, @Intel_Foundry, to lead advanced packaging and back-end manufacturing, strengthening our ability to deliver system-level innovation.

Naga Chandrasekaran will continue to lead front-end technology development, manufacturing, design enablement, and the end-to-end customer and business-facing functions that support foundry’s growth.

Navid Shahriari will retire after 37 years at Intel. His contributions helped advance Intel’s back-end technology leadership.

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