10h agoGenfabco CEO Matt Parlmer says Huawei's LogicFolding 3D-stacking method will boost wafer utilization from 20% to over 70%SMIC could produce millions of GPUs using this strategy.SentimentSentimentPos100%Neg0%Positive users praise Huawei adopting stacked small dies with Cerebras-style redundancy to raise chip yields, viewing it as the company taking the lead in advanced chip design.3 comments with sentiment. View comments.