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Wolfspeed introduces Premium 200 mm silicon carbide substrate

eeNews Europe reports the n-type substrate is designed to reduce defects and improve wafer shape stability. It has fewer than 0.01 micropipes per square centimeter, or fewer than three per wafer.

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1 Source, 10h ago, first seen 10h ago

TLDR

eeNews Europe reports Wolfspeed introduced a Premium 200 mm n-type silicon carbide (SiC) substrate designed to reduce defects and improve wafer shape stability. Wolfspeed is targeting higher manufacturing yields as SiC power devices move toward higher voltages and larger die sizes. The substrate has fewer than 0.01 micropipes per square centimeter, or fewer than three per wafer.

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@eeNewsEuropeWhat does better substrate quality mean for the shift to 200 mm SiC manufacturing? ⚡ Wolfspeed has introduced a Premium 200 mm n-type SiC substrate designed to reduce defects and improve wafer shape stability. The company is targeting higher manufacturing yields as SiC power devices move toward higher voltages and larger die sizes. The substrate has fewer than 0.01 micropipes per square centimeter, or fewer than three micropipes per wafer. Read more on eeNews Europe: https://www.eenewseurope.com/en/wolfspeed-adds-premium-200-mm-sic-substrate/
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    @eeNewsEuropeWhat does better substrate quality mean for the shift to 200 mm SiC manufacturing? ⚡ Wolfspeed has introduced a Premium 200 mm n-type SiC substrate designed to reduce defects and improve wafer shape stability. The company is targeting higher manufacturing yields as SiC power devices move toward higher voltages and larger die sizes. The substrate has fewer than 0.01 micropipes per square centimeter, or fewer than three micropipes per wafer. Read more on eeNews Europe: https://www.eenewseurope.com/en/wolfspeed-adds-premium-200-mm-sic-substrate/
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