Intel patent for MicroLEDs in chip packaging may enable optical interconnects
Tom's Hardware reports that Intel showcased a patent filed in 2022 for embedding MicroLEDs in chip packaging. Intel suggests they could be used for package diagnostics or customized lighting on chip surfaces.
TLDR
Tom's Hardware reports that Intel showcased a 2022 patent for embedding MicroLEDs in chip packaging. Intel suggests possible uses in package diagnostics and customized lighting; the technology may also enable embedded optical interconnects through TGVs as an alternative way to integrate co-packaged optics.
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