Besi Eyes CPO Upside as Hybrid Bonding Lags in HBM4E

LMAO Rubin Ultra's HBM literally got downgraded to 12 Hi, and they are not even using HB yet They won't use 16 Hi in 2027 Hybrid Bonding is very expensive for HBM rn (yields are abysmal) The big near-term upside for BESI is that TSMC's COUPE & Tower use Hybrid Bonding for EIC + PIC integration for CPO

China will be huge for BESI as Huawei is adopting HB for Logic Folding U can even see it in their China exposure

Don't expect Hybrid Bonding in HBM before 2028

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DRAM is broadly too expensive now, making the yield-hits from 16-Hi unjustifiable for the cost. Since HBM core dies are so precious, the base case is now squeezing more juice out of single dies and stretching out existing tech.

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@zephyr_z9 Higher concentration with China helps gross numbers but could be a drag on multiples for fear of geopolitical risk, no?

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@zephyr_z9 原来coupe也用混合键合👍

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