Rumor
TSMC is reportedly weighing a CoWoS price hike of up to 20%
Wccftech, citing China Times, reports that AI-chip demand and complexity are straining TSMC's advanced packaging capacity.
TLDR
Wccftech, citing China Times, reports that TSMC is discussing a price increase of up to 20% for CoWoS, its advanced chip-packaging technology. TSMC has not confirmed the report. Wccftech says AI chips with more compute dies and high-bandwidth memory stacks take longer to package and test, while equipment lead times have stretched from 3–6 months to 6–8 months.
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