AMD Says Hybrid-Bonded 3D DRAM Is 17x More Energy Efficient
Thermal challenges prevent commercialization despite the reported improvement over traditional HBM stacks.
Wccftech posted that AMD states its hybrid-bonded 3D DRAM reaches 17 times the energy efficiency of an HBM stack built with microbumps. The same post adds that thermal hurdles still block any move to commercialization. Coverage from the linked source notes d-Matrix is working on the heat problem by placing memory beneath the XPU. Atomic-level flatness is described as a remaining severe barrier. These details come directly from the visible posts and the attached article summary with no additional confirmation or timeline supplied.
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AMD Says Hybrid-Bonded 3D DRAM Is 17x More Energy Efficient
Thermal challenges prevent commercialization despite the reported improvement over traditional HBM stacks.
Wccftech posted that AMD states its hybrid-bonded 3D DRAM reaches 17 times the energy efficiency of an HBM stack built with microbumps. The same post adds that thermal hurdles still block any move to commercialization. Coverage from the linked source notes d-Matrix is working on the heat problem by placing memory beneath the XPU. Atomic-level flatness is described as a remaining severe barrier. These details come directly from the visible posts and the attached article summary with no additional confirmation or timeline supplied.