SK hynix announced on its account that the company began supplying HBM4E samples in June 2026. The post explains that this sample supply represents a key milestone. Customers use this stage to assess performance, reliability, power efficiency, and other attributes of the memory chips. The company states it is advancing HBM4E to support the future of AI memory. Related content in the packet includes a headline noting shipment of 12-Layer HBM4E samples for evaluation and a summary describing the supply of next-generation chips. The announcement comes directly from the manufacturer as a first-party statement about its own products.