Extropic Signs $75M LOI to Onshore Thermodynamic Computing
Startup aims to scale domestic production of energy-efficient AI hardware under federal agreement.
Extropic has entered into a letter of intent with the U.S. Department of Commerce to scale and manufacture its thermodynamic computing chips in the United States. The initiative focuses on producing Thermodynamic Sampling Units for AI workloads at American facilities, supported by planned CHIPS R&D funding. This development advances efforts to onshore advanced computing technology for energy-efficient AI, with announcements from company founders and reactions from the tech community highlighting its significance for domestic innovation.
We have signed a $75M LOI with the U.S. Department of Commerce to scale and onshore Thermodynamic Computing in the USA 🇺🇸 Read more: https://extropic.ai/writing/thermodynamic-computing-chips-in-america
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26 postsWe have signed a $75M LOI with the U.S. Department of Commerce to scale and onshore Thermodynamic Computing in the USA 🇺🇸 Read more:
Tired: Series A Wired: Series USA 🇺🇸🫡🦅
Thermodynamic computing is coming home 🇺🇸🫡
We have signed a $75M LOI with the U.S. Department of Commerce to scale and onshore Thermodynamic Computing in the USA 🇺🇸 Read more:
Brave naming choice for a company aiming to do business with the current USG.
Tired: Series A Wired: Series USA 🇺🇸🫡🦅
Future is coming at an accelerating rate. Many ships taking off at once, now. Congrats @GillVerd @trevormccrt1 🚀
We have signed a $75M LOI with the U.S. Department of Commerce to scale and onshore Thermodynamic Computing in the USA 🇺🇸 Read more:
@GillVerd Congrats 🇺🇸
