Samsung targets High NA EUV for high-volume DRAM production by 2028, eeNews Europe reports

eeNews Europe reports that Samsung and ASML are expanding their partnership around High NA EUV chipmaking technology. Samsung aims to use it for high-volume DRAM memory production by 2028, which the companies say would be an industry first. Samsung is also joining efforts to develop a 12-inch photomask platform. The outlet says the larger format could improve factory productivity, reduce manufacturing costs and help address future chip-patterning challenges.