Samsung Details Three-Phase HBM Roadmap at Hot Chips 2026

Samsung detailed a three-phase HBM roadmap at Hot Chips 2026. The company described steps that move logic functions into the base die. Later phases add compute capabilities inside the memory stack. The final stage places DRAM directly on top of the processor. Tom's Hardware reported the presentation and its focus on tighter integration between memory and processing elements. The account confirms the three-phase structure and the progression toward zHBM as the endpoint. No other outcomes or timelines appear in the coverage.