Close to 80 out of 100 HBM3 chips fail final tests at the Chinese memory maker, Wccftech reports, citing Korean media.
Wccftech, citing a Korean media report, says CXMT’s HBM memory chip yields have fallen to 25%, with close to 80 out of 100 HBM3 chips failing final tests. The outlet describes difficulties with chip stacking and says assembly complications make HBM chips significantly harder to manufacture than traditional DRAM modules.
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Close to 80 out of 100 HBM3 chips fail final tests at the Chinese memory maker, Wccftech reports, citing Korean media.
Wccftech, citing a Korean media report, says CXMT’s HBM memory chip yields have fallen to 25%, with close to 80 out of 100 HBM3 chips failing final tests. The outlet describes difficulties with chip stacking and says assembly complications make HBM chips significantly harder to manufacture than traditional DRAM modules.
Wccftech@wccftechChina's CXMT faces HBM memory chip shock as yields sink to 25% with close to 80 out of 100 HBM3 chips failing final tests. 🔗 https://wccf.tech/1l7e1
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Wccftech@wccftechChina's CXMT faces HBM memory chip shock as yields sink to 25% with close to 80 out of 100 HBM3 chips failing final tests. 🔗 https://wccf.tech/1l7e1