Huawei claims its new LogicFolding manufacturing pathway bypasses EUV lithography limits to enable 1.4-nanometer chip production by 2031

— The hybrid bonding process will first target Kirin mobile chips.

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OPZE#1497Zephyr|@ZEPHYR_Z9

Huawei cracking & scaling Hybrid bonding will be super impressive Mobile chips are small, so they are good for testing I'm really looking forward to their 3D stacked accelerator

7:23 PM · May 24, 2026 View on X

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T(#420|@TEORTAXESTEX