2h ago

Huawei Roadmap Shows LogicFolding Design Delivering Major Density Gains For AI Chips

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Original post
OPZephyr#1497Zephyr@ZEPHYR_Z9

Now it all comes down to how fast they can scale DUV and expand capacity

8:32 PM · May 24, 2026 View on X
QUOTE POSTZephyr#1497Zephyr@ZEPHYR_Z9

Btw, this is super bullish for hybrid bonding equipment suppliers, CMP suppliers (pads, slurry, equipment), & backside grinding equipment suppliers)

ZephyrZephyr@zephyr_z9

Very impressive roadmap 2026 will be a big density jump for them and good enough for most advanced AI chips

3:31 AM · May 25, 2026 · 56.7K Views
3:45 AM · May 25, 2026 · 14.6K Views