AIHuawei accelerates AI chip roadmap with Ascend 960 series to challenge Nvidia
Huawei announced advancing Ascend 960DT to Q1 2027 and Ascend 960PR to Q3 2027, with 970/980 chips planned for 2028/2029. The company highlighted 1,000+ Ascend supernode deployments and new Atlas 960 SuperPoD technology. DeepSeek reportedly ordered 160k+ Ascend chips.
TLDR
This demonstrates China accelerating domestic AI hardware development to reduce Nvidia dependence amid US export controls. Scaled deployments and improved manufacturing signal a shift in the global AI chip supply chain and reflect intensifying US-China AI hardware competition.
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Huawei accelerates AI chip roadmap with Ascend 960 series to challenge Nvidia
Huawei announced advancing Ascend 960DT to Q1 2027 and Ascend 960PR to Q3 2027, with 970/980 chips planned for 2028/2029. The company highlighted 1,000+ Ascend supernode deployments and new Atlas 960 SuperPoD technology. DeepSeek reportedly ordered 160k+ Ascend chips.
TLDR
This demonstrates China accelerating domestic AI hardware development to reduce Nvidia dependence amid US export controls. Scaled deployments and improved manufacturing signal a shift in the global AI chip supply chain and reflect intensifying US-China AI hardware competition.