Cerebras Head Shares 3D DRAM Roadmap News from Hot Chips

Sarah Chieng, Head of DevX at Cerebras, posted on X about the Hot Chips conference. She described excitement over DRAM moving into the third dimension and stated that D-Matrix and Cerebras both announced 3D stacked DRAM on their product roadmaps this year. The post adds that for decades one of the fundamental constraints on memory bandwidth has been physical because DRAM and compute live on separate silicon.