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    AMD Helios' TH6 switch design and its reported reliance on Broadcom

    AMD announced the second episode of its Helios engineering videos on September 24. SemiAnalysis says it showed the TH6 scale-up switch design publicly for the first time and points to Broadcom retimers beside flyover cables.

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    AMD said on September 24 that the second Helios episode was arriving that day, with testing up next. SemiAnalysis later said it offered a first public look at the TH6 scale-up switch design. The outlet argues that Helios relies on Broadcom for its scale-up switch and retimers, and says the retimers and flyover cables present manufacturing and signal-performance challenges, while the retimers add latency.

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    @SemiAnalysis_AMD Helios (partial co-design): AMD revealed the TH6 scale up switch design publicly for the first time. If you look close enough, you can spot all the Broadcom ethernet retimers next to the flyover cables coming from the backplane into the switch ASIC. This design demonstrates AMD's lack of complete silicon product portfolio, particularly a scale up switch, which is necessary for a scale up rack. In the case of Helios, AMD relies on Broadcom for the scale up switch and retimers alone the scale up path. In the future, AMD are also working with UALink switch vendors in their pursuit of a true UALink scale up system. https://www.broadcom.com/products/ethernet-connectivity/phy-and-poe/optical/bcm83361. In our advancing AI 2026 article, we talked about the challenges with these retimers and flyover cables towards manufacturing and signal performance. The retimers also add extra latency alone the scale up path. https://open.substack.com/pub/semianalysis/p/can-amd-break-the-cuda-moat-amd-advancing?r=2tvhp5&selection=49db110a-6f59-4bae-91a7-2492a088fac3&utm_campaign=post-share-selection&utm_medium=web&aspectRatio=instagram&textColor=%23ffffff&bgImage=true