Teortaxes posted that XRING 03 is a high-end Xiaomi SoC on 6nm with wafer-on-wafer NPU-DRAM bonding at 1.4µm pitch and expressed surprise that TSMC apparently fabricated it. Tunguz replied that a Xiaomi Cube belongs in every home. The two posts link to images and another account but supply no first-party Xiaomi announcement or product confirmation. Packet summaries mention a prototype with three custom chips, 200 TOPS NPU, and up to 160GB memory, yet those details remain unverified claims tied only to the social reactions.