TERAFAB IS GOING TO BE INSANE.
We’re targeting 100–200 billion custom AI + memory chips per year at full ramp that’s 1 terawatt (1,000 GW) of annual AI compute capacity. Roughly 50x current global AI chip output.
This isn’t incremental. This is the kind of scale that actually moves the needle on civilization.
Breakdown:
- 80% (~160 billion chips / 800 GW) → radiation-hardened D3 chips for orbital data centers. Space-based compute at massive scale, powered by solar, low latency for Earth, immune to most terrestrial risks.
- 20% (~40 billion chips / 200 GW) → terrestrial AI5 & AI6 edge inference processors for Tesla vehicle fleets and Optimus robots.
Facility plan: start at 100k wafer-starts/month, scale to 1 million wafers/month. Everything design, EUV lithography, fab, memory, packaging, test under one roof. That recursive self-improvement loop is the real unlock.
Small-batch AI5 chips in 2026. High-volume Terafab output targeted for mid-2028/2029.
This is how we make AI abundant, affordable, and truly useful for making life multi-planetary and maximizing human potential.
The future is going to be ridiculously bright.
