Report
TSMC reportedly plans a CoWoS price increase of up to 20%
A post attributes the reported increase to AI packaging demand outpacing supply as it spreads beyond GPUs.
TLDR
A post says TSMC is reportedly preparing another CoWoS price rise of up to 20% as AI packaging demand outstrips supply. It describes CoWoS as joining AI processors to high-bandwidth memory and says equipment lead times have grown from 3–6 months to 6–8 months. The post also says larger packages reduce each tool’s hourly output.
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4 Sources, first seen ago
