Huawei proposes "Tau Scaling Law" roadmap to integrate active MEMS micropumps directly into next-generation silicon
The technology will first target Kirin smartphone processors.
More on Huawei vision around Tau Law. It all reduces to topology. I suspect that by 2030 the paradigm will change beyond what they see now. They'll have to resolve integration of cooling into the chip, rebuild EDA… Then, computronium is the limit. Maximum density at every node.
and they will build intra-chip cooling. But first, baby steps in smartphone SoCs.
Zephyr@zephyr_z9HOLD UP "MEMS micropumps" If Huawei is really putting a micropump in Kirin then it's a pretty big breakthrough. No wonder, the heat signature envelope was so decent
#1497Zephyr@ZEPHYR_Z9HOLD UP "MEMS micropumps" If Huawei is really putting a micropump in Kirin then it's a pretty big breakthrough.
No wonder, the heat signature envelope was so decent
